US Patent Issued to STMicroelectronics (Grenoble 2) on May 26 for "Integrated circuit comprising an assembly of an electronic chip, an optical element and a substrate and corresponding manufacturing method" (French Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,638,644, issued on May 26, was assigned to STMicroelectronics (Grenoble 2) SAS (Grenoble, France).

"Integrated circuit comprising an assembly of an electronic chip, an optical element and a substrate and corresponding manufacturing method" was invented by Romain Coffy (Voiron, France) and Younes Boutaleb (Grenoble, France).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit package includes an assembly of an electronic integrated circuit chip, an optical element and a support substrate. The support substrate includes a mounting face and has an opening sized and shaped to containing the electronic integrated circuit chip. The optical eleme...