ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,964, issued on Aug. 18, was assigned to STMicroelectronics (Grenoble 2) SAS (Grenoble, France).
"Integrated circuit package" was invented by Romain Coffy (Voiron, France) and Younes Boutaleb (Grenoble, France).
According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit package includes a support substrate and a cover fastened on a first face of the support substrate. The cover and support substrate define a housing containing an electronic integrated circuit chip having a first face equipped with electrically conductive protruding elements. A first space between the cover and a second face of the electronic integrated circuit chip is filled ...