US Patent Issued to STMICROELECTRONICS, STMICROELECTRONICS on Feb. 17 for "Semiconductor package with gas release holes" (Singaporean, Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,694, issued on Feb. 17, was assigned to STMICROELECTRONICS LTD (Kowloon, Hong Kong) and STMICROELECTRONICS PTE LTD (Singapore).

"Semiconductor package with gas release holes" was invented by David Gani (Choa Chu Kang, Singapore) and Hui-Tzu Wang (Zhubei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a silicon substrate with an active surface and an inactive surface. A semiconductor device, such as an image, light, or optical sensor, is formed in the active surface and disposed on the substrate. A glass plate is coupled to the substrate with adhesive. The glass plate includes a sensor area that corresponds to ...