US Patent Issued to STMicroelectroncis (Grenoble 2) on Aug. 18 for "QFN package comprising two electronic chips with different substrates" (French Inventors)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,944, issued on Aug. 18, was assigned to STMicroelectroncis (Grenoble 2) SAS (Grenoble, France).

"QFN package comprising two electronic chips with different substrates" was invented by Romain Coffy (Voiron, France) and Younes Boutaleb (Grenoble, France).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package includes a mounting plate having a first part able to dissipate heat and a second part able to transmit and/or receive electrical signals. A cladding houses a first electronic chip and second electronic chip. The first electronic chip has a first semiconductor substrate (giving off, in operation, a first quantity of heat) mounted to the first par...