US Patent Issued to STATS ChipPAC on March 24 for "Semiconductor device and methods of making and using an enhanced carrier to reduce electrostatic discharge" (South Korean Inventors)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,588,463, issued on March 24, was assigned to STATS ChipPAC Pte. Ltd. (Singapore).

"Semiconductor device and methods of making and using an enhanced carrier to reduce electrostatic discharge" was invented by MoonSu Han (Incheon, South Korea), YoungJun Kim (Gyeonggi-do, South Korea), DongChae Kim (Incheon, South Korea), Ilhan Jung (Seoul, South Korea) and Cheolsoo Lee (Incheon, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device is made with a boat carrier including stainless steel. A Polytetrafluoroethylene (PTFE) layer is formed over the boat carrier. A semiconductor package substrate is disposed over the boat carrier. A m...