US Patent Issued to STATS ChipPAC on March 24 for "Semiconductor device and method of forming fine pitch conductive posts with graphene-coated cores" (South Korean Inventors)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,588,572, issued on March 24, was assigned to STATS ChipPAC Pte. Ltd. (Singapore).

"Semiconductor device and method of forming fine pitch conductive posts with graphene-coated cores" was invented by YongMoo Shin (Incheon, South Korea), HeeSoo Lee (Incheon, South Korea) and SeungHyun Lee (Incheon, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device has a substrate and an electrical component disposed over a first surface of the substrate. A first encapsulant is deposited over the first surface of the substrate. A second encapsulant is deposited over a second surface of the substrate with a via formed in the second encapsulan...