US Patent Issued to STATS ChipPAC on July 21 for "Method of making a semiconductor package with graphene for die attach" (South Korean Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,316, issued on July 21, was assigned to STATS ChipPAC Pte. Ltd. (Singapore).

"Method of making a semiconductor package with graphene for die attach" was invented by YongMoo Shin (Incheon, South Korea), HeeSoo Lee (Incheon, South Korea) and SuJeong Kwon (Incheon, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device has a substrate with a die pad. A conductive material is disposed on the die pad. The conductive material includes a plurality of graphene-coated metal balls in a matrix. A semiconductor die is disposed on the conductive material. The conductive material is sintered using an infrared laser. A bond wire is forme...