US Patent Issued to STATS ChipPAC on Jan. 27 for "Semiconductor device and methods of making and using thermally advanced semiconductor packages" (South Korean Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,799, issued on Jan. 27, was assigned to STATS ChipPAC Pte. Ltd. (Singapore).

"Semiconductor device and methods of making and using thermally advanced semiconductor packages" was invented by Hyun-kyu Lee (Incheon, South Korea), Ji-seon Lee (Incheon, South Korea) and Bum-ryul Maeng (Incheon, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a substrate. A semiconductor die is disposed over the substrate. An encapsulant is deposited over the substrate and semiconductor die. A first trench is formed in the encapsulant over the semiconductor die. A conductive layer is formed over the encapsulant and into the first...