US Patent Issued to STATS ChipPAC on Feb. 3 for "Semiconductor device and method of forming dummy vias in WLP" (Singaporean Inventors)

ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,543,590, issued on Feb. 3, was assigned to STATS ChipPAC Pte. Ltd. (Singapore).

"Semiconductor device and method of forming dummy vias in WLP" was invented by Peik Eng Ooi (Singapore) and Lee Sun Lim (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device has a semiconductor substrate and first insulating layer formed over the surface of the semiconductor substrate. A dummy via is formed through the first insulating layer. A second insulating layer is formed over the first insulating layer to fill the dummy via. A first conductive layer is formed over the second insulating layer. A bump is formed over the first conductive layer a...