US Patent Issued to SP SEMICONDUCTOR & COMMUNICATION on Oct. 14 for "Blade dicing device for wafers" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,444,624, issued on Oct. 14, was assigned to SP SEMICONDUCTOR & COMMUNICATION Co. LTD. (Bucheon-si, South Korea).

"Blade dicing device for wafers" was invented by Jae Up Kim (Bucheon-si, South Korea), Ki Joon Ahn (Bucheon-si, South Korea), Jeong Min Kim (Bucheon-si, South Korea) and Sung Rae Jin (Bucheon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a blade dicing device for wafers that cuts (dices) a wafer with the grit on a cutting blade and separates the wafer into individual chips, and that can minimize process defects when dicing compound semiconductor wafers made of high-hardness materials such as SiC. The device includ...