US Patent Issued to Sony Semiconductor Solutions on Sept. 8 for "Solid-state imaging device, method for manufacturing the same, and electronic apparatus" (Japanese Inventor)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,287, issued on Sept. 8, was assigned to Sony Semiconductor Solutions Corp. (Kanagawa, Japan).

"Solid-state imaging device, method for manufacturing the same, and electronic apparatus" was invented by Kyohei Mizuta (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present technology relates to a solid-state imaging device compatible with miniaturization of pixels, a method for manufacturing the solid-state imaging device, and an electronic apparatus. The solid-state imaging device is formed by joining a front surface side as the wiring layer formation surface of the first semiconductor substrate to a back surface side of the second ...