US Patent Issued to SONY SEMICONDUCTOR SOLUTIONS on Sept. 8 for "Solid-state imaging apparatus, manufacturing method thereof, and electronic equipment" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,288, issued on Sept. 8, was assigned to SONY SEMICONDUCTOR SOLUTIONS Corp. (Kanagawa, Japan).

"Solid-state imaging apparatus, manufacturing method thereof, and electronic equipment" was invented by Hiroki Oomori (Kanagawa, Japan) and Nobutoshi Fujii (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to a solid-state imaging apparatus, a manufacturing method thereof, and electronic equipment that are able to suppress nonuniform reflection of incident light. The solid-state imaging apparatus includes an imaging element chip and a device chip. The imaging element chip has a semiconductor substrate. The device...