US Patent Issued to Sony Semiconductor Solutions on Sept. 2 for "Imaging element, stacked imaging element, and solid-state imaging apparatus" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 3 -- United States Patent no. 12,408,455, issued on Sept. 2, was assigned to Sony Semiconductor Solutions Corp. (Kanagawa, Japan).

"Imaging element, stacked imaging element, and solid-state imaging apparatus" was invented by Taiichiro Watanabe (Kanagawa, Japan), Fumihiko Koga (Kanagawa, Japan), Kyosuke Ito (Kanagawa, Japan), Hideaki Togashi (Kanagawa, Japan) and Yusaku Sugimori (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An imaging element includes a photoelectric conversion unit including a first electrode 11, a photoelectric conversion layer 13, and a second electrode 12 that are stacked, in which the photoelectric conversion unit further includes a charge storage...