US Patent Issued to Sony Semiconductor Solutions on Sept. 15 for "Solid-state imaging device, method for manufacturing cover glass, and electronic apparatus" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,736,715, issued on Sept. 15, was assigned to Sony Semiconductor Solutions Corp. (Kanagawa, Japan).

"Solid-state imaging device, method for manufacturing cover glass, and electronic apparatus" was invented by Katsunori Takahashi (Kumamoto, Japan) and Shoichi Hirooka (Kumamoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A solid-state imaging device with high versatility having a cavity-less CSP structure capable of reducing the occurrence of flare and also being applied to chip size reduction, a method for manufacturing a cover glass, and an electronic apparatus. A solid-state imaging device includes: a sensor substrate in which a plurality of ...