US Patent Issued to Sony Semiconductor Solutions on Oct. 27 for "Semiconductor device" (Japanese Inventor)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,776,628, issued on Oct. 27, was assigned to Sony Semiconductor Solutions Corp. (Kanagawa, Japan).

"Semiconductor device" was invented by Takanori Okamura (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a semiconductor device capable of easily reducing parasitic capacitance between wirings.A semiconductor device according to the present disclosure includes a first substrate, a lower wiring provided on the first substrate, a plurality of upper wirings provided on the lower wiring via an insulation film, and a second substrate provided on the upper wirings via a plurality of elements, in which the upper wirings include a first wiring and ...