US Patent Issued to SONY SEMICONDUCTOR SOLUTIONS on March 31 for "Semiconductor package" (Japanese Inventors)

ALEXANDRIA, Va., March 31 -- United States Patent no. 12,593,524, issued on March 31, was assigned to SONY SEMICONDUCTOR SOLUTIONS Corp. (Kanagawa, Japan).

"Semiconductor package" was invented by Hikaru Ohira (Kanagawa, Japan), Ninao Sato (Kanagawa, Japan), Yiochiro Fujinaga (Kanagawa, Japan) and Atsushi Tsukada (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A yield drop of a semiconductor package including a via is reduced. The semiconductor package includes a solid-state imaging element, a circuit layer, a wiring layer, and a support substrate. The solid-state imaging element in the semiconductor package generates image data. A signal processing circuit that performs predetermined signal p...