US Patent Issued to SONY SEMICONDUCTOR SOLUTIONS on June 30 for "Solid-state imaging device, method of manufacturing the same, and electronic device" (Japanese Inventor)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,379, issued on June 30, was assigned to SONY SEMICONDUCTOR SOLUTIONS Corp. (Kanagawa, Japan).

"Solid-state imaging device, method of manufacturing the same, and electronic device" was invented by Shunsuke Maruyama (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a solid-state imaging device that includes a first semiconductor layer including a first photoelectric conversion element that photoelectrically converts light to a signal charge, and a charge holding region that holds the signal charge, a second semiconductor layer on the first semiconductor layer with a first insulating layer interposed therebetween and includes ...