US Patent Issued to Sony Semiconductor Solutions on June 3 for "Solid-state imaging device and electronic device" (Japanese Inventors)

ALEXANDRIA, Va., June 4 -- United States Patent no. 12,324,266, issued on June 3, was assigned to Sony Semiconductor Solutions Corp. (Kanagawa, Japan).

"Solid-state imaging device and electronic device" was invented by Ikumi Takeda (Kanagawa, Japan) and Takuro Murase (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A solid-state imaging device capable of weakening incident light that passes through an effective pixel region and enters an optical black pixel region. Among a plurality of straight groove portions constituting a trench portion, a first straight groove portion is formed at a boundary between an effective pixel region and an optical black pixel region (OPB pixel region), a plurality...