ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,740, issued on June 23, was assigned to SONY SEMICONDUCTOR SOLUTIONS Corp. (Kanagawa, Japan).
"Solid-state imaging device" was invented by Rui Morimoto (Kanagawa, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention is a solid-state imaging device including: a semiconductor support substrate; a wiring layer formed on the semiconductor support substrate and including a predetermined metal wiring pattern; a photoelectric conversion layer provided on the wiring layer and including a plurality of photoelectric conversion elements that are formed in an array to generate charges by photoelectric conversion based on light incident on ...