US Patent Issued to Sony Semiconductor Solutions on June 16 for "Imaging element with bonded chips or substrates and method for manufacturing imaging element" (Japanese Inventor)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,333, issued on June 16, was assigned to Sony Semiconductor Solutions Corp. (Kanagawa, Japan).

"Imaging element with bonded chips or substrates and method for manufacturing imaging element" was invented by Kenta Fukushima (Kumamoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "To prevent damage to an imaging element configured by bonding a plurality of semiconductor chips together. The imaging element includes a plurality of semiconductor chips each having a semiconductor substrate and a wiring region. One of the plurality of semiconductor chips is provided with a photoelectric conversion unit for performing photoelectric conversion of incide...