US Patent Issued to Sony Semiconductor Solutions on Feb. 17 for "Defect density calculation method, defect-density calculation program, defect-density calculation apparatus, heat treatment control system and machining control system" (Japanese Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,601, issued on Feb. 17, was assigned to Sony Semiconductor Solutions Corp. (Kanagawa, Japan).

"Defect density calculation method, defect-density calculation program, defect-density calculation apparatus, heat treatment control system and machining control system" was invented by Nobuyuki Kuboi (Kanagawa, Japan) and Koji Eriguchi (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A defect density calculation method according to one embodiment of the present disclosure is a method of calculating a temporal change of the defect density distribution in a semiconductor layer. The method includes calculating the temporal change of the defect den...