US Patent Issued to SONY SEMICONDUCTOR SOLUTIONS on Aug. 25 for "Display module, method of manufacturing the same, and electronic device" (Japanese Inventor)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,683, issued on Aug. 25, was assigned to SONY SEMICONDUCTOR SOLUTIONS Corp. (Kanagawa, Japan).

"Display module, method of manufacturing the same, and electronic device" was invented by Hiroshi Nishikawa (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a display module capable of reducing connection resistance between a mounting board and a display.A display module includes a mounting board provided with a bump, and a display mounted on the mounting board and provided with a connection terminal bonded to the bump by solid-phase diffusion bonding."

The patent was filed on Feb. 10, 2022, under Application No. 18/264,096.

*Fo...