US Patent Issued to Sony Semiconductor Solutions on Aug. 11 for "Solid-state imaging element, imaging apparatus, and electronic device" (Japanese Inventor)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,751, issued on Aug. 11, was assigned to Sony Semiconductor Solutions Corp. (Kanagawa, Japan).

"Solid-state imaging element, imaging apparatus, and electronic device" was invented by Kyosuke Yamada (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to a solid-state imaging element, an imaging apparatus, and an electronic device that can reduce the effects caused by a PAD electrode being formed. When laminating a Logic substrate smaller than an image sensor, a through hole is formed in the image sensor in such a manner as to form a PAD electrode in an embedded member embedded around the logic substrate. The ...