ALEXANDRIA, Va., April 21 -- United States Patent no. 12,609,507, issued on April 21, was assigned to SONY SEMICONDUCTOR SOLUTIONS Corp. (Kanagawa, Japan).
"Electronic device" was invented by Takashi Imahigashi (Kumamoto, Japan) and Tsuyoshi Asakawa (Kumamoto, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic device according to the present disclosure includes a semiconductor substrate, a chip, and a bump. The chip has a thermal expansion coefficient different from that of the semiconductor substrate. The bump connects the connection pads provided on the opposing principal surfaces of the semiconductor substrate and the chip. The bump has a porous metal layer and a metal film. The metal film...