US Patent Issued to Sony Semiconductor Solutions, Taiwan Semiconductor Manufacturing on Sept. 1 for "Semiconductor device" (Japanese, Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,469, issued on Sept. 1, was assigned to Sony Semiconductor Solutions Corp. (Kanagawa, Japan) and Taiwan Semiconductor Manufacturing Co Ltd (Hsinch, Taiwan).

"Semiconductor device" was invented by Haruhiko Terada (Kanagawa, Japan) and Tseng Kuo-Chyuan (Hsinch, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device according to an embodiment of the present disclosure includes: a first memory cell layer including a first selection line extending in a first direction, a second selection line extending in a second direction, and a first memory cell coupled to the first selection line and the second selection line; a second memory ce...