US Patent Issued to Sony Semiconductor Solutions, Riken on Dec. 16 for "Light-receiving element, x-ray imaging element, and electronic apparatus" (Japanese Inventors)

ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,501,727, issued on Dec. 16, was assigned to Sony Semiconductor Solutions Corp. (Kanagawa, Japan) and Riken (Saitama, Japan).

"Light-receiving element, x-ray imaging element, and electronic apparatus" was invented by Takaki Hatsui (Saitama, Japan), Takahiro Kawamura (Kanagawa, Japan) and Hiroki Tojinbara (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A light-receiving element according to an embodiment of the present disclosure includes: a semiconductor substrate (11) including a photoelectric conversion region; a first electrically-conductive region (13A) provided at an interface of one surface of the semiconductor substrate (11) and co...