US Patent Issued to Sony Group on July 28 for "Method of manufacturing semiconductor device, and semiconductor device" (Japanese Inventor)

ALEXANDRIA, Va., July 28 -- United States Patent no. RE50,975, issued on July 28, was assigned to Sony Group Corp. (Tokyo).

"Method of manufacturing semiconductor device, and semiconductor device" was invented by Yuki Miyanami (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing a semiconductor device includes: the first step of forming a gate electrode over a silicon substrate, with a gate insulating film; and the second step of digging down a surface layer of the silicon substrate by etching conducted with the gate electrode as a mask. The method of manufacturing the semiconductor device further includes the third step of epitaxially growing, on the surface of the dug-d...