US Patent Issued to SONY GROUP on Jan. 20 for "Wireless data link layer compression and decompression" (British Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,218, issued on Jan. 20, was assigned to SONY GROUP Corp. (Tokyo).

"Wireless data link layer compression and decompression" was invented by Vivek Sharma (Basingstoke, Great Britain), Hideji Wakabayashi (Basingstoke, Great Britain), Yuxin Wei (Basingstoke, Great Britain) and Yassin Aden Awad (Basingstoke, Great Britain).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of processing data frames for transmission on a wireless access interface of a wireless communications system, the method comprising receiving a first data frame comprising a first protocol header, the first protocol header associated with a medium access control (MAC) frame format...