US Patent Issued to SONY GROUP, SONY CORPORATION OF AMERICA on Sept. 9 for "Secondary link access to a mobile soft access point multi-link device" (California Inventors)

ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,414,026, issued on Sept. 9, was assigned to SONY GROUP Corp. (Tokyo) and SONY CORPORATION OF AMERICA.

"Secondary link access to a mobile soft access point multi-link device" was invented by Li-Hsiang Sun (San Jose, Calif.), Mohamed Abouelseoud (Burlingame, Calif.), Liangxiao Xin (San Jose, Calif.) and Qing Xia (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An IEEE 802.11 wireless protocol which allows a non-Access Point Multi-Link Device (non-AP MLD) to access a soft AP MLD (e.g., an MLD which is not configured for Simultaneous Transmit and Receive (STR)) over a conditional link (Link2) when the primary/basic link (Link1) is occupied ...