US Patent Issued to Solutia on Feb. 10 for "Multiple layer interlayer having improved acoustic properties" (Massachusetts, California Inventors)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,545,012, issued on Feb. 10, was assigned to Solutia Inc. (St. Louis).

"Multiple layer interlayer having improved acoustic properties" was invented by Hengyi Ju (Longmeadow, Mass.) and Keyuan Huang (Mountain View, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Multilayered interlayers having improved acoustic properties comprising a stiff skin layer(s) and a soft core layer comprising EVA are disclosed. The multilayered interlayers comprise: a first polymer layer (skin layer); a second polymer layer (skin layer); and a third polymer layer (core layer) comprising ethylene vinyl acetate resin between the first polymer layer and the second polymer la...