US Patent Issued to Solstice Advanced Materials US on Oct. 27 for "Diffusion bonded tungsten containing target to copper alloy backing plate" (Washington Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,774,517, issued on Oct. 27, was assigned to Solstice Advanced Materials US Inc. (Morris Plains, N.J.).

"Diffusion bonded tungsten containing target to copper alloy backing plate" was invented by Xiaodan Wu (Spokane, Wash.), Susan D. Strothers (Mead, Wash.), Rashmi Mohanty (Liberty Lake, Wash.) and Wayne Meyer (Cheney, Wash.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A sputtering target assembly comprises a tungsten containing sputtering target, a copper alloy backing plate attached to the tungsten containing sputtering target, and an interlayer positioned between and diffusion bonding the tungsten containing sputtering target and copper alloy backin...