US Patent Issued to Soitec on Nov. 3 for "Composite structure for MEMS applications, comprising a deformable layer and a piezoelectric layer, and associated manufacturing process" (French Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,648, issued on Nov. 3, was assigned to Soitec (Bernin, France).

"Composite structure for MEMS applications, comprising a deformable layer and a piezoelectric layer, and associated manufacturing process" was invented by Bruno Ghyselen (Bernin, France) and Francois Darras (Bernin, France).

According to the abstract* released by the U.S. Patent & Trademark Office: "A composite structure comprises a receiver substrate having at least one cavity defined in the substrate and devoid of solid material or filled with a sacrificial solid material, a single-crystal semiconductor layer disposed on the receiver substrate, the layer having a free surface over the entire extent of the structure ...