US Patent Issued to Smith & Nephew on Sept. 9 for "Component positioning and encapsulation for sensor enabled wound dressings" (British Inventor)

ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,409,071, issued on Sept. 9, was assigned to Smith & Nephew PLC (Watford, Great Britain).

"Component positioning and encapsulation for sensor enabled wound dressings" was invented by Philip Gowans (Doncaster, Great Britain).

According to the abstract* released by the U.S. Patent & Trademark Office: "Devices and methods for encapsulating a portion of a wound dressing with biocompatible coating are disclosed. In some embodiments, a method includes applying a first coating on a first side of a flexible substrate of the wound dressing. The first side of the substrate can support a plurality of electronic components, electronic tracks, and connectors between the electronic components and ...