US Patent Issued to Skyworks Solutions on May 26 for "Method of making packaged acoustic wave devices with multilayer piezoelectric substrate" (Japanese Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,640,699, issued on May 26, was assigned to Skyworks Solutions Inc. (Irvine, Calif.).

"Method of making packaged acoustic wave devices with multilayer piezoelectric substrate" was invented by Keiichi Maki (Suita, Japan), Hironori Fukuhara (Ibaraki, Japan) and Rei Goto (Osaka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of making a surface acoustic wave package includes bonding a piezoelectric layer over a substrate and attaching a metal structure over the substrate, with the piezoelectric layer positioned between at least a portion of the substrate and at least a portion of the metal structure. The method also includes removing (e.g., et...