US Patent Issued to Skyworks Solutions on June 16 for "Packaging substrates having reduced deformation and methods related thereto" (California Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,080, issued on June 16, was assigned to Skyworks Solutions Inc. (Irvine, Calif.).

"Packaging substrates having reduced deformation and methods related thereto" was invented by Bhuvaneshwaran Vijayakumar (Irvine, Calif.), Lori Ann Deorio (Irvine, Calif.), Anthony James Lobianco (Irvine, Calif.), Hoang Mong Nguyen (Fountain Valley, Calif.) and Robert Francis Darveaux (Corona Del Mar, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A packaging substrate can include a first surface having a first mounting region of a first electronic module region and a second mounting region of a second electronic module region, the second electronic module regio...