ALEXANDRIA, Va., July 7 -- United States Patent no. 12,677,378, issued on July 7, was assigned to Skyworks Solutions Inc. (Irvine, Calif.).
"Apparatus and methods for tool mark free stitch bonding" was invented by Aldrin Quinones Garing (Mexicali, Mexico).
According to the abstract* released by the U.S. Patent & Trademark Office: "Apparatus and method for tool mark free stich bonding. In some embodiments, a method for wire bonding can include feeding a wire through a capillary tip and attaching a first end of the wire to a first location, thereby forming a ball bond. The method can further include moving the capillary tip towards a second location while the wire feeds out of the capillary tip. The method can further include attaching a se...