US Patent Issued to Skyworks Solutions on July 14 for "Heat dissipation structure for laterally excited bulk acoustic wave device" (Japanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,683,571, issued on July 14, was assigned to Skyworks Solutions Inc. (Irvine, Calif.).

"Heat dissipation structure for laterally excited bulk acoustic wave device" was invented by Rei Goto (Osaka, Japan) and Hironori Fukuhara (Ibaraki, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An acoustic wave device is disclosed. The acoustic wave deice can include a membrane structure and a support substrate. The membrane structure includes a piezoelectric layer, an interdigital transducer electrode arranged on the piezoelectric layer, and a thermally conductive layer arranged at least partially in contact with the piezoelectric layer. The support substrate ...