US Patent Issued to Skyworks Solutions on Jan. 13 for "Semiconductor wafer with probe pads located in saw street" (Massachusetts, California Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,525,492, issued on Jan. 13, was assigned to Skyworks Solutions Inc. (Irvine, Calif.).

"Semiconductor wafer with probe pads located in saw street" was invented by Guillaume Alexandre Blin (Carlisle, Mass.) and Engin Ibrahim Pehlivanoglu (Costa Mesa, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor wafer comprising a first die including a first integrated circuit having a trimmable or programmable component. The trimmable or programmable component is configured to be trimmed or permanently altered in response to an electrical signal. The semiconductor wafer also includes a saw street arranged adjacent to the first die, and at least on...