US Patent Issued to Skyworks Solutions on Feb. 3 for "Packaged surface acoustic wave device with conductive roof supporting structure" (Japanese Inventors)

ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,542,533, issued on Feb. 3, was assigned to Skyworks Solutions Inc. (Irvine, Calif.).

"Packaged surface acoustic wave device with conductive roof supporting structure" was invented by Hironori Fukuhara (Ibaraki, Japan), Rei Goto (Osaka, Japan) and Keiichi Maki (Suita, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A packaged surface acoustic wave device is disclosed. The packaged surface acoustic wave device can include a support substrate that has a first side and a second side opposite the first side. The support substrate including a conductive via extending vertically between the first side to the second side. The packaged surface acoustic wave ...