US Patent Issued to Skyworks Solutions on Aug. 4 for "Self-shielded acoustic wave device package" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,700,848, issued on Aug. 4, was assigned to Skyworks Solutions Inc. (Irvine, Calif.).

"Self-shielded acoustic wave device package" was invented by Atsushi Takano (Kadoma, Japan), Mitsuhiro Furukawa (Nishinomiya, Japan) and Takeshi Furusawa (Toyonaka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A packaged acoustic wave component has an acoustic wave device mounted on a device substrate and a cap substrate spaced above the device substrate. The packaged acoustic wave component also has a shield structure including a metal plate disposed on a bottom surface of the cap substrate that faces the device substrate, the metal plate being spaced above the ...