US Patent Issued to Skyworks Solutions on April 14 for "Packaged acoustic wave devices with multi-layer piezoelectric substrate" (Japanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,603,636, issued on April 14, was assigned to Skyworks Solutions Inc. (Irvine, Calif.).

"Packaged acoustic wave devices with multi-layer piezoelectric substrate" was invented by Rei Goto (Osaka, Japan), Hironori Fukuhara (Ibaraki, Japan) and Takuya Ushiyama (Moriguchi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Aspects of this disclosure relate to a packaged acoustic wave component with two acoustic wave devices interconnected by a thermally conductive frame, at least one of the acoustic wave devices including a multi-layer piezoelectric substrate. The multi-layer piezoelectric substrate includes a support layer and a piezoelectric layer dispo...