US Patent Issued to SK keyfoundry on Nov. 3 for "Method for manufacturing semiconductor die" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,670, issued on Nov. 3, was assigned to SK keyfoundry Inc. (Cheongju-si, South Korea).

"Method for manufacturing semiconductor die" was invented by Dal Jin Lee (Cheongju-si, South Korea), Yang Beom Kang (Cheongju-si, South Korea) and Kang Sup Shin (Cheongju-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for manufacturing a semiconductor die includes forming a front side of a semiconductor wafer; etching a surface of the semiconductor wafer to a predetermined depth to form a first aperture in the front side of the semiconductor wafer; forming a protective layer on the front side of the semiconductor wafer and performing a first...