US Patent Issued to SK hynix on May 26 for "Buffer chip, semiconductor package including buffer chip and memory chip, memory module, and operation method of semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,640,175, issued on May 26, was assigned to SK hynix Inc. (Icheon-si, South Korea).

"Buffer chip, semiconductor package including buffer chip and memory chip, memory module, and operation method of semiconductor package" was invented by Choung Ki Song (Icheon-si, South Korea) and Kwan Dong Kim (Icheon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package may include: a package substrate including a plurality of terminals for communication with a memory controller and a plurality of bonding pads for communication inside a package; a buffer chip located on the package substrate; a plurality of memory chips stacked on the buf...