US Patent Issued to SK hynix on May 26 for "Buffer chip, semiconductor package including buffer chip and memory chip, and memory module" (South Korean Inventor)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,640,189, issued on May 26, was assigned to SK hynix Inc. (Icheon-si, South Korea).

"Buffer chip, semiconductor package including buffer chip and memory chip, and memory module" was invented by Choung Ki Song (Icheon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A buffer chip includes: an external control signal interface configured to receive control signals transmitted from a memory controller; an internal control signal interface configured to transmit the control signals to a plurality of memory chips; an external data interface configured to transmit and receive (transmit/receive) data to and from (to/from) the memory controller; an ...