US Patent Issued to SK hynix on May 26 for "Buffer chip, semiconductor package including buffer chip and memory chip, and memory module" (South Korean Inventor)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,640,184, issued on May 26, was assigned to SK hynix Inc. (Icheon-si, South Korea).

"Buffer chip, semiconductor package including buffer chip and memory chip, and memory module" was invented by Choung Ki Song (Icheon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A buffer chip may include: a chip select signal reception circuit configured to receive system chip select signals transmitted from a memory controller; a chip select signal mapping circuit configured to generate memory chip select signals by mapping the system chip select signals by using failed memory chip information; and a chip select signal transmission circuit configured to ...