US Patent Issued to SK hynix on July 14 for "Stack packages" (South Korean Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,231, issued on July 14, was assigned to SK hynix Inc. (Icheon-si, South Korea).

"Stack packages" was invented by Eun Hye Do (Icheon-si, South Korea) and Chang Shik Jung (Icheon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A stack package is provided. The stack package includes a package substrate on which a first bond finger and a second bond finger are spaced apart from each other, and a second semiconductor die stacked over a first semiconductor die. A first connector connects the first semiconductor die to the first bond finger. A second connector connects the second semiconductor die to the second bond finger and extends to hav...