ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,711, issued on Jan. 20, was assigned to SK hynix Inc. (Icheon-si, South Korea).
"Manufacturing method of semiconductor package" was invented by Young Chan Oh (Icheon-si, South Korea), Hee Jong Kang (Icheon-si, South Korea) and Young Mok Bae (Icheon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing a semiconductor package includes manufacturing dies on each of wafers, testing the wafers including the dies, calculating total scores for the wafers according to results of the tests, and setting reference values corresponding to semiconductor products. The method also includes classifying, as the semiconductor produ...