US Patent Issued to SK hynix on Dec. 16 for "Semiconductor chip including through electrodes, and semiconductor package including the same" (South Korean Inventor)

ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,500,176, issued on Dec. 16, was assigned to SK hynix Inc. (Icheon-si, South Korea).

"Semiconductor chip including through electrodes, and semiconductor package including the same" was invented by Ho Young Son (Icheon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor chip according to an embodiment includes a body portion with a front surface and a rear surface, the body portion being oriented in such a way that the rear surface is above the front surface, first and second through electrodes penetrating the body portion with protrusions that protrude above the rear surface of the body portion, a wiring portion formed under th...