US Patent Issued to SK Hynix NAND Product Solutions on Sept. 22 for "Methods and systems for controlling underfill bleed-out in semiconductor packaging" (California Inventor)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,592, issued on Sept. 22, was assigned to SK Hynix NAND Product Solutions Corp. (Rancho Cordova, Calif.).

"Methods and systems for controlling underfill bleed-out in semiconductor packaging" was invented by Bilal Khalaf (Folsom, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "This application is directed to controlling underfill bleed-out in semiconductor packaging. A first substrate is disposed on a support substrate, and a bracket structure is placed on the support substrate with a first separation from the first substrate. An underfill material is applied on the support substrate. The bracket structure automatically controls bleed-out of th...