US Patent Issued to SK hynic on March 3 for "Packaging device including bumps and method of manufacturing the same" (South Korean Inventors)

ALEXANDRIA, Va., March 3 -- United States Patent no. 12,568,829, issued on March 3, was assigned to SK hynic Inc. (Icheon-si, South Korea).

"Packaging device including bumps and method of manufacturing the same" was invented by Jae Jun Lee (Icheon-si, South Korea), Jong Yeon Kim (Icheon-si, South Korea), Jong Hoon Kim (Icheon-si, South Korea), Ju Heon Yang (Icheon-si, South Korea) and Mi Seon Lee (Icheon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A packaging device including bumps and a method of manufacturing the packaging device are presented. In the method of manufacturing a packaging device, a dielectric layer that covers a packaging base is formed and a lower layer is formed over a p...